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Call for Papers

The 3rd International Electronic Conference on Materials Science

The 3rd International Electronic Conference on Materials Science (ECMS 2018) will be held from 14 to 28 May 2018. All proceedings will be held online at http://sciforum.net/conference/ecms2018.

Throughout this event, we aim to cover the following topics:

The conference will be completely free of charge—both to attend, and for scholars to upload and present their latest work on the conference platform. There will be a possibility to submit selected papers to the journal Materials (ISSN 1996-1944; 2.654 (2016); http://www.mdpi.com/journal/materials), with a 10% discount on the APCs; ECMS 2018 offers you the opportunity to participate in this international, scholarly conference without having the concern or expenditure of travel — all you need is your computer and access to the Internet.

This year, as a sponsor, Materials would like to award the best paper as elected by the conference committee. The Award will consist of 500 Swiss Francs. We would like to invite you to “attend” this conference by presenting your latest work.

Abstracts (in English) should be submitted by 06 Feb. 2018 online at http://www.sciforum.net/login. For accepted abstracts, the full paper can be submitted by 14 Apr. 2018. The conference itself will be held 14–28 May 2018.

Paper Submission Guidelines

For information about the procedure for submission, peer-review, revision and acceptance of conference proceedings papers, please refer to the section "Instructions for Authors" http://sciforum.net/admin/manage/conference/ecms2018/page/instructions.

Time Schedule

  • Abstract Submission: 06 Feb. 2018
  • Acceptance Notification: 27 Feb. 2018
  • Full Paper Submission: 14 Apr. 2018
  • Conference Open: 14–28 May 2018
Sponsors