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Florin Udrea      
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Florin Udrea published an article in January 2019.
Top co-authors See all
Andrea De Luca

42 shared publications

Department of Engineering, University of Cambridge, Cambridge CB2 1PZ, UK

Daniel Popa

30 shared publications

Department of Engineering, University of Cambridge, Cambridge CB3 0FA, UK

Syed Zeeshan Ali

10 shared publications

Ams Sensors UK Limited, Cambridge CB4 0DL, UK

Richard Hopper

5 shared publications

Ams Sensors UK Limited, Cambridge CB4 0DL, UK

Sophie Boual

4 shared publications

Ams Sensors UK Limited, Cambridge CB4 0DL, UK

41
Publications
3
Reads
0
Downloads
66
Citations
Publication Record
Distribution of Articles published per year 
(1999 - 2019)
Total number of journals
published in
 
29
 
Publications See all
Article 0 Reads 0 Citations MEMS Thermal Flow Sensors – An Accuracy Investigation Ethan L. W. Gardner, Timothy A. Vincent, Rhys G. Jones, Juli... Published: 01 January 2019
IEEE Sensors Journal, doi: 10.1109/jsen.2019.2891596
DOI See at publisher website
Article 0 Reads 0 Citations Membrane Deflection and Stress in Thermal Flow Sensors Claudio Falco, Ethan L. W. Gardner, Andrea De Luca, Nicolas ... Published: 11 December 2018
Proceedings, doi: 10.3390/proceedings2131089
DOI See at publisher website ABS Show/hide abstract
The effect of membrane deflection has been investigated for thermal flow sensors. Catastrophic membrane breakage is a common occurrence in membrane based thermal flow sensors due to thermal expansion and internal stresses. This work analyses three sensors comprising a tungsten heater embedded in buried oxide membrane with a silicon nitride passivation layer, the use of back etching creates a cavity underneath to reduce the thermal conduction. The investigation is done using interferometry to measure the membrane shape at room and operating temperature for three membranes of different sizes. As expected, the deflection increases with temperature up to 15 µm at operating temperature and with the reduction of membrane size the deflection is reduced to a minimum of 3 µm for the smallest membrane. The lower deflection measured in devices with a smaller cavity can be related to a reduced internal stress, improving the long term stability.
Article 0 Reads 0 Citations On-Chip Thermal Insulation Using Porous GaN Bogdan F. Spiridon, Peter H. Griffin, John C. Jarman, Yingju... Published: 10 December 2018
Proceedings, doi: 10.3390/proceedings2130776
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This study focuses on the thermal characterization of porous gallium nitride (GaN) usingan extended 3ω method. Porous semiconductor materials provide a solution to the need for on-chipthermal insulation, a fundamental requirement for low-power, high-speed and high-accuracythermal sensors. Thermal insulation is especially important in GaN devices, due to the intrinsicallyhigh thermal conductivity of the material. The results show one order of magnitude reduction inthermal conductivity, from 130 W/mK to 10 W/mK, in line with theoretical predictions for porousmaterials. This achievement is encouraging in the quest for integrating sensors with opto-, powerandRF-electronics on a single GaN chip.
Article 0 Reads 0 Citations A CMOS-Based Thermopile Array Fabricated on a Single SiO2 Membrane Richard Hopper, Syed Zeeshan Ali, Sophie Boual, Andrea De Lu... Published: 22 November 2018
Proceedings, doi: 10.3390/proceedings2130878
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We present a novel thermopile-based infrared (IR) sensor array fabricated on a single CMOS dielectric membrane, comprising of poly-silicon p+ and n+ elements. Processing of the chip is simplified by fabricating the entire array on a single membrane and by using standard CMOS Al metal layers for thermopile cold junction heatsinking. On a chip area of 1.76 mm × 1.76 mm, with a membrane size of 1.2 mm × 1.2 mm, we fabricated IR sensor arrays with 8 × 8 to 100 × 100 pixels. The 8 × 8 pixel device has
Article 0 Reads 0 Citations Evaluation of thin film p-type single crystal silicon for use as a CMOS Resistance Temperature Detector (RTD) Zahid Mehmood, Mohtashim Mansoor, Ibraheem Haneef, S. Zeesha... Published: 01 November 2018
Sensors and Actuators A: Physical, doi: 10.1016/j.sna.2018.09.062
DOI See at publisher website
Article 0 Reads 2 Citations A maskless etching technique for fabrication of 3D MEMS structures in SOI CMOS devices Mohtashim Mansoor, Ibraheem Haneef, Andrea De Luca, John Cou... Published: 09 May 2018
Journal of Micromechanics and Microengineering, doi: 10.1088/1361-6439/aabe0d
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