Please login first
Hyun‐Cheol Bae  - - - 
Top co-authors See all
Kwang-Seong Choi

106 shared publications

ICT Materials and Components Research Laboratory; Electronics and Telecommunications Research Institute (ETRI); Daejeon South Korea

Yong-Hwan Kwon

62 shared publications

Components and Materials Research Laboratory, Electronics and Telecommunications Research Institute (ETRI), Daejeon, 305-700, Korea

Yong-Sung Eom

50 shared publications

ICT Materials and Components Research Laboratory; Electronics and Telecommunications Research Institute (ETRI); Daejeon South Korea

Jong‐Tae Moon

44 shared publications

Integrated Optical Module Team, ETRI

Jin‐Young Kang

18 shared publications

56
Publications
0
Reads
0
Downloads
23
Citations
Publication Record
Distribution of Articles published per year 
(2005 - 2017)
Total number of journals
published in
 
29
 
Publications See all
Article 0 Reads 1 Citation Crosslinkable deoxidizing hybrid adhesive of epoxy-diacid for electrical interconnections in semiconductor packaging Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 13 June 2018
Polymer International, doi: 10.1002/pi.5631
DOI See at publisher website
Article 0 Reads 1 Citation Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 14 May 2018
Industrial & Engineering Chemistry Research, doi: 10.1021/acs.iecr.8b01142
DOI See at publisher website
Article 0 Reads 1 Citation Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic ana... Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 06 May 2018
Journal of Applied Polymer Science, doi: 10.1002/app.46639
DOI See at publisher website
PROCEEDINGS-ARTICLE 0 Reads 0 Citations Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate Kwang-Seong Choi, Wagno Alves Braganca Junior, leeseul Jeong... Published: 01 May 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), doi: 10.1109/ectc.2018.00238
DOI See at publisher website
PROCEEDINGS-ARTICLE 0 Reads 0 Citations Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test Wagno Alves Braganca, Yong-Sung Eom, Jihye Son, Keon-Soo Jan... Published: 01 December 2017
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), doi: 10.1109/eptc.2017.8277495
DOI See at publisher website
Article 0 Reads 0 Citations Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser Kwang-Seong Choi, Wagno Alves Braganca, Keon-Soo Jang, Hyun-... Published: 01 October 2017
International Symposium on Microelectronics, doi: 10.4071/isom-2017-TP31_027
DOI See at publisher website
Top