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Kwang‐Seong Choi  - - - 
Top co-authors See all
Yong-Duck Chung

104 shared publications

ICT Materials Technology Research Laboratory, Electronics and Telecommunications Research Institute, Daejeon 34129, Korea

Jeha Kim

55 shared publications

Convergence Components & Materials Laboratory; Electronics and Telecommunications Research Institute; Daejeon; 305-700; Korea

Yong-Hwan Kwon

49 shared publications

Components and Materials Research Laboratory, Electronics and Telecommunications Research Institute (ETRI), Daejeon, 305-700, Korea

Joong-Seon Choe

45 shared publications

Photonics/Wireless Convergence Research Division, Electronics and Telecommunications Research Institute (ETRI), 218 Gajeong-ro, Yuseong-gu, Daejeon 34129, South Korea

Yong-Sung Eom

43 shared publications

ICT Materials and Components Research Laboratory; Electronics and Telecommunications Research Institute (ETRI); Daejeon South Korea

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Publication Record
Distribution of Articles published per year 
(2000 - 2019)
Total number of journals
published in
 
23
 
Publications See all
Article 0 Reads 0 Citations Collective laser‐assisted bonding process for 3D TSV integration with NCP Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang, Seok Hwa... Published: 16 April 2019
ETRI Journal, doi: 10.4218/etrij.2018-0171
DOI See at publisher website ABS Show/hide abstract
Laser‐assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single‐tier LAB process for 3D through‐silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single‐tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu‐Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.
Article 0 Reads 1 Citation Crosslinkable deoxidizing hybrid adhesive of epoxy-diacid for electrical interconnections in semiconductor packaging Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 13 June 2018
Polymer International, doi: 10.1002/pi.5631
DOI See at publisher website
Article 0 Reads 1 Citation Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 14 May 2018
Industrial & Engineering Chemistry Research, doi: 10.1021/acs.iecr.8b01142
DOI See at publisher website
Article 0 Reads 1 Citation Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic ana... Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 06 May 2018
Journal of Applied Polymer Science, doi: 10.1002/app.46639
DOI See at publisher website
PROCEEDINGS-ARTICLE 0 Reads 0 Citations Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate Kwang-Seong Choi, Wagno Alves Braganca Junior, leeseul Jeong... Published: 01 May 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), doi: 10.1109/ectc.2018.00238
DOI See at publisher website
PROCEEDINGS-ARTICLE 0 Reads 0 Citations Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test Wagno Alves Braganca, Yong-Sung Eom, Jihye Son, Keon-Soo Jan... Published: 01 December 2017
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), doi: 10.1109/eptc.2017.8277495
DOI See at publisher website
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