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Kwang-Seong Choi  - - - 
Top co-authors See all
Yong-Duck Chung

104 shared publications

ICT Materials Technology Research Laboratory, Electronics and Telecommunications Research Institute, Daejeon 34129, Korea

Jeha Kim

74 shared publications

Convergence Components & Materials Laboratory; Electronics and Telecommunications Research Institute; Daejeon; 305-700; Korea

Yong-Hwan Kwon

62 shared publications

Components and Materials Research Laboratory, Electronics and Telecommunications Research Institute (ETRI), Daejeon, 305-700, Korea

Hyunā€Cheol Bae

56 shared publications

ICT Materials and Components Research Laboratory; Electronics and Telecommunications Research Institute (ETRI); Daejeon South Korea

Joong-Seon Choe

55 shared publications

Photonics/Wireless Convergence Research Division, Electronics and Telecommunications Research Institute (ETRI), 218 Gajeong-ro, Yuseong-gu, Daejeon 34129, South Korea

105
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39
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Publication Record
Distribution of Articles published per year 
(2000 - 2017)
Total number of journals
published in
 
26
 
Publications See all
Article 0 Reads 1 Citation Crosslinkable deoxidizing hybrid adhesive of epoxy-diacid for electrical interconnections in semiconductor packaging Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 13 June 2018
Polymer International, doi: 10.1002/pi.5631
DOI See at publisher website
Article 0 Reads 1 Citation Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 14 May 2018
Industrial & Engineering Chemistry Research, doi: 10.1021/acs.iecr.8b01142
DOI See at publisher website
Article 0 Reads 1 Citation Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic ana... Keon-Soo Jang, Yong-Sung Eom, Kwang-Seong Choi, Hyun-Cheol B... Published: 06 May 2018
Journal of Applied Polymer Science, doi: 10.1002/app.46639
DOI See at publisher website
PROCEEDINGS-ARTICLE 0 Reads 0 Citations Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate Kwang-Seong Choi, Wagno Alves Braganca Junior, leeseul Jeong... Published: 01 May 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), doi: 10.1109/ectc.2018.00238
DOI See at publisher website
PROCEEDINGS-ARTICLE 0 Reads 0 Citations Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test Wagno Alves Braganca, Yong-Sung Eom, Jihye Son, Keon-Soo Jan... Published: 01 December 2017
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), doi: 10.1109/eptc.2017.8277495
DOI See at publisher website
Article 0 Reads 0 Citations Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser Kwang-Seong Choi, Wagno Alves Braganca, Keon-Soo Jang, Hyun-... Published: 01 October 2017
International Symposium on Microelectronics, doi: 10.4071/isom-2017-TP31_027
DOI See at publisher website
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