
Non-Destructive Testing and Evaluation (NDT&E) is essential for inspecting materials without compromising their serviceability. Among the wide range of NDT&E methods, Infrared Thermography (IRT) has gained prominence for its non-contact operation and rapid inspection capabilities. Passive thermography, though simple and fast, is limited in detecting small, deep sub-surface features. To address this challenge, active thermography applies a controlled thermal stimulus to probe sub-surface anomalies quantitatively. However, conventional pulse-based and lock-in methods still face limitations such as shallow penetration, high power demands, and repetitive testing requirements.
In this webinar, Prof. Dr. Ravibabu Mulaveesala will introduce innovative insights into Frequency Modulated Thermal Wave Imaging (FMTWI) and its integration with correlation-based post-processing for enhanced sub-surface defect detection and interface bond quality evaluation in metals and sandwich structures. The presentation will explore how thermal responses, captured using infrared thermography, are analysed through frequency-domain, time-domain, and Cross-Correlation Coefficient (CCC) methods—where CCC quantifies the similarity between thermal responses to enhance defect detection.
This session will highlight the significance of combining FMTWI with CCC post-processing to achieve superior sensitivity in identifying delamination and sub-surface anomalies.
Date: 12 December 2025
Time: 3:00 pm CET | 9:00 am EST | 10:00 pm CST Asia
Webinar ID: 849 9164 2981
Webinar Secretariat: journal.webinar@mdpi.com
Centre for Sensors, iNstrumentation and cyber-physical Systems Engineering (SeNSE), Indian Institute of Technology Delhi, India;
Prof. Dr. Ravibabu Mulaveesala is a Professor at the Centre for Sensors, Instrumentation and Cyber-Physical Systems Engineering (SeNSE), Indian Institute of Technology Delhi (IIT Delhi), India. He obtained his M.Tech. from the National Institute of Technology (NIT), Tiruchirappalli in 2000 and his Ph.D. from the Centre for Applied Research in Electronics (CARE), IIT Delhi in 2007. His research interests focus on the development of thermal, acoustical, and optical methods for non-invasive imaging and non-destructive testing (NDT) technologies. Prof. Mulaveesala has made significant contributions to the field of sensors and imaging systems and is actively engaged in research on advanced diagnostic and evaluation techniques. He serves on the editorial and advisory boards of several prestigious international journals published by the American Institute of Physics (AIP), Institute of Physics (IOP), IEEE, IET, Elsevier, Taylor & Francis, and Springer Nature, and regularly contributes to various peer-reviewed international conferences.
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