Cite
Avraham, M.; Golan, G.; Vaiana, M.; Bruno, G.; Castagna, M.E.; Stolyarova, S.; Blank, T.; Nemirovsky, Y. Wafer Level Packaged CMOS-SOI-MEMS Thermal Sensor at Wide Pressure Range for IoT Applications, in Proceedings of the 7th International Electronic Conference on Sensors and Applications, 15–30 November 2020, MDPI: Basel, Switzerland, doi:10.3390/ecsa-7-08191