Events9th International Electronic Conference on Sensors and Applications
Published
This submission belongs to the session B. Physical Sensors of the event 9th International Electronic Conference on Sensors and Applications
Published date
01 Nov, 2022
Academic Editor
author-avatarFrancisco Falcone
Citation
Tiago Vicentini Ferreira do Valle, Aldo Ghisi, Stefano Mariani, Francesco Rizzini, Gabriele Gattere, Luca Falorni, Luca Guerinoni, On-chip tests for the characterization of the mechanical strength of polysilicon, in Proceedings of 9th International Electronic Conference on Sensors and Applications, 1 November–15 November 2022, MDPI: Basel, Switzerland, doi: 10.3390/ecsa-9-13363
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On-chip tests for the characterization of the mechanical strength of polysilicon

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Gabriele Gattere 2
Francesco Rizzini 2
Luca Falorni 2
1. Department of Civil and Environmental Engineering, Politecnico di Milano
2. STMicroelectronics, AMS Group - R&D, Italy
Abstract

Microelectromechanical systems (MEMS) are nowadays widespread in the sensor market with a number of different applications. New production techniques and ever smaller device geometries require a continuous investigation of potential failure mechanisms in such devices. This work presents an experimental on-chip setup to assess the geometry- and material-dependent strength of stoppers adopted to limit the deformation of movable parts, using an electrostatically actuated device. A series of comb-fingers and parallel plates are used to provide a rather large stoke to a shuttle, connected to the anchors through flexible springs. Upon application of a varying voltage, failure of stoppers of variable size is observed and confirmed by postmortem ΔC-V curves. Results of an experimental campaign are collected to infer the stochastic property of the strength of polycrystalline, columnar silicon films.

Keywords
polysilicon tensile strength
polysilicon thin films
on-chip mechanical testing
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