EventsThe 5th International Online Conference on Nanomaterials
Published
This submission belongs to the session S4. Modeling and Simulation of Nanostructures and Nanodevices of the event The 5th International Online Conference on Nanomaterials
Published date
18 Sep, 2025
Academic Editor
author-avatarSotirios Baskoutas
Citation
Bsm Elsafi, Magnetoresistance in Co/Cu magnetic metallic superlattices: influence of copper layer thickness at low temperatures, in Proceedings of The 5th International Online Conference on Nanomaterials, 22 September–24 September 2025, MDPI: Basel, Switzerland
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Magnetoresistance in Co/Cu magnetic metallic superlattices: influence of copper layer thickness at low temperatures

1. Electronics, National School of Electronics and Communications of Sfax, University of Sfax , Tunisia, Sfax, 3018, Tunisia, Tunisia
Abstract

This research investigates the magnetoresistance (MR) behavior of Co/Cu magnetic superlattices with a fixed cobalt (Co) layer thickness of 20 Å, focusing on how variations in the copper (Cu) layer's thickness affect the MR response across a broad temperature range (4.2–300 K). This study specifically explores the influence of the Cu layer's thickness, interfacial structure, and surface morphology on spin-dependent electron scattering, which is the dominant mechanism governing the MR ratio in such multilayered systems. A detailed theoretical framework is employed, incorporating spin-dependent Boltzmann transport equations and realistic interface models, to capture how modifications in the electron reflection, transmission, and spin filtering at the Co/Cu interfaces influence MR. Numerical simulations reveal a pronounced decrease in the MR as the Cu's thickness increases from 5 Å to 150 Å, particularly at cryogenic temperatures, where ballistic and quantum transport effects are more pronounced. This trend is attributed to reduced spin asymmetry and enhanced diffuse scattering in thicker Cu layers. The theoretical results show excellent agreement with experimental measurements conducted on electrodeposited multilayers, demonstrating the validity of the model. These findings highlight the critical importance of controlling both the Cu spacer's thickness and the interface integrity to optimizing the MR performance. These insights are essential for the design of advanced spintronic devices, where precise engineering at the atomic scale is required to achieve high spin polarization and efficient electron transport.

Keywords
Co/Cu superlattices
Magnetoresistance
Electrical resistivity
Cu layer thickness
Temperature dependence
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