Three-Dimensional Current Density Distribution Simulations and experimental determination of electrodeposited Porous Nickel-Tungsten on Fiber Cloth substrate

Nickel-tungsten (Ni-W) alloys are promising alternatives to platinum group metals (PGMs) for electrocatalytic applications, offering a balance between cost-effectiveness and catalytic efficiency. While nickel is an effective catalyst for the hydrogen evolution reaction (HER), its performance can be significantly enhanced by alloying with tungsten. This synergistic effect improves catalytic efficiency, durability, and corrosion resistance, making Ni-W alloys suitable for renewable energy and energy storage applications. However, depositing uniform and stable coatings on porous substrates, such as carbon cloth, presents challenges due to non-uniform current distribution, which can lead to inconsistent deposition and degradation over time.

In this work, we present a novel approach to optimizing Ni-W electrodeposition on porous substrates by integrating experimental techniques with advanced computational modeling. Using the Multi-Ion Transport and Reaction Model (MITReM) combined with Butler–Volmer kinetics, we develop a 3D model to predict current density and layer thickness distributions. We also perform a detailed sensitivity analysis of key deposition parameters, including electrolyte conductivity, charge transfer coefficients, and current densities, to better understand their impact on Ni-W coating uniformity. Experimental results, including thickness distribution measurements, show strong agreement with the simulated data, validating the model's effectiveness.

This study not only provides valuable insights into the electroplating of Ni-W alloys on porous substrates but also offers a scalable, efficient approach to optimizing deposition parameters. The findings have significant implications for improving the plating of electrocatalytic materials and process efficiency, with potential applications in renewable energy and industrial-scale electrochemical systems.