LPE application technique for obtaining of thin film semiconductor materials

A new technique of liquid phase epitaxy (LPE) has been proposed in this work. It allows to eliminate known disadvantages of LPE by creating short-time contact between a substrate and a solution-melt, as well as due to segmental deposition of an epitaxial layer over the working substrate surface. The short-time of the contact is achieved by the means of Ampere force acting on the solution-melt. And the contact itself between the substrate and the solution-melt is realized pointwise (or segmentally) over the substrate surface using the scanning principle. The new technique was named "scanning liquid phase epitaxy". One of the modifications of device realization of the technique proposed has been considered and its principle of operation has been described. Preliminary theoretical investigations and experimental processes of semiconductor epitaxial layers obtaining have proved principal operational capability of the new technique. The technique developed allows to obtain thin and ultrathin epitaxial layers on the substrates of very large area which is limited only by the growth equipment size.