Events The Eighteenth International Conference of Experimental Mechanics

Event submissions

Published

This submission belongs to the session ICEM. ICEM 2018 of the event The Eighteenth International Conference of Experimental Mechanics

Published date

18 Jun, 2018

Citation

Jan Chvojan, Jaroslav Vaclavik, PCB TESTS DURING ASEEMBLY AND SPLITTING, in Proceedings of The Eighteenth International Conference of Experimental Mechanics, Brussels, 1 July–5 July 2018, MDPI: Basel, Switzerland, doi: 10.3390/ICEM18-05365

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PCB TESTS DURING ASEEMBLY AND SPLITTING

Jan Chvojan ^1,2

Jaroslav Vaclavik ^1,2

1. VZU Plzen, Dynamic Testing Laboratory

2. CZECH REPUBLIC

Abstract

The flexure inspection of printed circuit boards during assembly and operation is the object of the article. The goal is to identify high stresses which can lead to destruct especially the soldered connections during final product operation using strain gauge technique. This is demonstrated on some examples. It is shown how important is the proper wires installation leading from strain gauges to measurement unit. The tests are performed according IPC guidelines but some remarks are given to guidelines specification.

Keywords

printed circuit board

strain gauge test

PCB

PCB assembly

PCB splitting

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