Hero Image

International Conference on Intelligent Electronics and Micro/Nanosystems (Intelectro)

12 - 14 April 2027
Barcelona, Spain

Welcome from
the chairs

Dear Colleagues,

It is our pleasure to invite you to Intelectro 2027, an international conference organized by MDPI and supported by the MDPI journals Electronics and Micromachines. The event will be held in Barcelona, Spain, from 12–14 April 2027.

Intelectro 2027 aims to bring together researchers, engineers, and innovators working at the forefront of modern electronics, from micro- and nanoscale systems to intelligent, AI-driven devices that are shaping the next generation of technology. As electronics continue to evolve at a remarkable speed, cross-disciplinary collaboration has never been more essential. This conference provides a unique platform to explore advances in MEMS/NEMS, sensors and actuators, microfluidics, flexible electronics, energy harvesting, optoelectronics, embedded and intelligent systems, IoT, quantum and neuromorphic devices, and many other rapidly advancing areas.

We welcome submissions for short talks and poster presentations related to the conference themes. Intelectro 2027 will offer an engaging and dynamic environment where participants can share their latest findings, discuss emerging challenges, and build meaningful connections across academia, industry, and applied research.

We look forward to welcoming you to Barcelona for three inspiring days of scientific exchange, innovation, and collaboration.

Sincerely,

José Luis Sánchez-Rojas and Piero Cosseddu
Intelectro 2027 Chairs

Conference Secretariat

Ms. Raquel Selles
Ms. Jovana Vanovac
Ms. Dusica Radovanovic
Email: intelectro2027@mdpi.com



Meet the Event Chairs

Prof. Dr. Piero Cosseddu
Prof. Dr. Piero Cosseddu
Department of Electrical and Electronic Engineering, University of Cagliari, Cagliari, Italy
Prof. Dr. José Luis Sánchez-Rojas
Prof. Dr. José Luis Sánchez-Rojas
Microsystems, Actuators, and Sensors Laboratory, Universidad de Castilla-La Mancha, Toledo, Spain

Important Dates


  • Abstract submission deadlineNov 13, 2026
  • Abstract acceptance notificationDec 14, 2026
  • Early bird registration deadlineJan 18, 2027
  • Regular registration deadlineApr 05, 2027
  • Late registration deadlineApr 09, 2027

Meet Our Speakers

View all speakers
Prof. Dr. Weileun Fang

Prof. Dr. Weileun Fang

Power Mechanical Engineering Department, National Tsing Hua University of Taiwan ;
Prof. Fang has been working in the MEMS field for more than 30 years. He received his Ph.D. degree from Carnegie Mellon University (Pittsburgh, PA) in 1995. His doctoral research focused on the determining of the mechanical properties of thin films using MEMS structures. He joined the Power Mechanical Engineering Department at the National Tsing Hua University (Taiwan) in 1996, where he is now a Chair Professor as well as a faculty of NEMS Institute. From June to September 1999, he was at California Inst. of Tech. as a visiting associate. He became the IEEE Fellow in 2015 to recognize his contribution in MEMS area.

Prof. Oliver G. Schmidt

Prof. Oliver G. Schmidt

Chemnitz University of Technology;
Professor Oliver G. Schmidt is the Scientific Director of the Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) and holds the Chair of Material Systems for Nanoelectronics at the Chemnitz University of Technology, Germany. He is Adjunct Professor of Nanophysics at Dresden University of Technology, Germany and Honorable Professor at both Fudan University and Changzhou University. He is an elected member of the German Academy of Science and Engineering and received numerous international prizes and awards: Among them the Otto-Hahn Medal from the Max-Planck-Society in 2000, the Philip-Morris Research Award in 2002, the Carus-Medal from the German Academy of Natural Scientists Leopoldina in 2005, the International Dresden Barkhausen Award in 2013, the Leibniz-Prize of the German Research Foundation in 2018, and an Advanced Grant of the European Research Council (ERC) in 2019. He is a pioneer in micromachining microrobotics, their biomedical applications and their potential for creating artificial life. He has made major scientific contributions to small scale energy storage devices, flexible electronics and 3D integrated microsystems. He has authored and co-authored > 900 papers with a citation index > 70.000 and an H-index of 136.

Session Topics
Explore more details
  • S1. MEMS/NEMS
  • S2. Microfluidics, LoC & Bioelectronics
  • S3. Advanced Materials, Fabrication Processes & Flexible Electronics
  • S4. Photonics, Optoelectronics & Quantum Devices
  • S5. IoT, Wearables, Cyber-Physical & AI-Driven Systems
12
Plan Your Trip

Travel

Barcelona is a vibrant and accessible city with excellent transportation links. Whether you're arriving by plane, train, or other means, there are convenient options to reach your destination. Below, you'll find detailed guidance to ensure a smooth journey to the conference venue.

By plane:

The international airport of Barcelona, Barcelona-El Prat, is located 10 km from the city center. It is well connected to major airport hubs in Europe and various locations worldwide. For more information about the airport and flights, please visit the official website: https://www.aena.es. Once you arrive at the airport, you have several options to reach the venue:

  • By metro: Take LINE L9 (https://www.tmb.cat) which connects Barcelona Airport (both Terminal 1 and Terminal 2) to the city. Disembark at Collblanc station, and from there, transfer to METRO L5 (get off at Diagonal). The metro from the airport costs EUR 5.90, while a single city metro trip is EUR 2.90. Barcelona offers several public transport card options: the T-casual (10 trips, EUR 13 for Zone 1, not valid for the airport) and the T-usual (unlimited travel for 30 days, EUR 22.80 for Zone 1, including the airport via metro). There are also Hola Barcelona tourist cards, offering unlimited travel for 48 to 120 hours, but local cards usually offer better value for money. Tickets can be purchased at metro stops.
  • By train: Take the TRAIN R2 NORD (https://rodalies.gencat.cat). Disembark at Barcelona Sants station. From there, you can either take METRO L5 (get off at Diagonal) or a taxi, available just outside the station. The train from the airport costs approx. EUR 5. Tickets can be purchased at train stations. A taxi from the station to the conference venue costs approximately EUR10.
  • By taxi: Taxis are readily available just outside the arrivals area. A taxi from the airport to the conference venue costs approximately EUR 35. Alternatively, VTC apps like Uber, Bolt, and Cabify also operate in Barcelona and usually offer more competitive rates.

By train:

Barcelona Sants is the city's largest train station, providing rail services for Barcelona, the rest of Spain, and international destinations. For more information about the station and train services, please visit the official website: https://www.renfe.com. Once you arrive at the station, you have the following options to reach the venue:

  • By metro: Take LINE L5 (https://www.tmb.cat) and get off at Diagonal.
  • By taxi: Taxis are available just outside the station. A taxi from the station to the conference venue costs approx EUR 10-15.
Partnership Opportunities

Sponsoring

As organizers, we are excited to create an immersive and insightful conference, and we invite you to be a vital part of Intelectro2027. Explore our sponsorship opportunities and join us in shaping the future of Electronics and Micromachines research and innovation.

Find the perfect sponsorship package tailored to your budget and desired exposure in our sponsorship brochure. Simply contact us via email at intelectro2027@mdpi.com. We appreciate your consideration!

Society Collaboration

Are you part of a society that isn't partnering with the conference? Contact us via email at intelectro2027@mdpi.com to discuss a possible partnership! Noteworthy detail: Members from partnering societies are granted a 20% discount on all registration fees.

Sponsors and Partners

Organizer


MDPIElectronicsMicromachines

Media partner


World Electric Vehicle Journal (WEVJ)TechnologiesNanomaterialsMicroEngComputersSemiconductors and Heterogeneous Integration

Powered by Sciforum
Disclaimer
Terms and ConditionsPrivacy PolicyAccessibility