2021 International Conference on Materials: Advanced and Emerging Materials
To ensure participants' safety during the ongoing pandemic, the ICM-CN 2021 Organizing Committee has decided to to cancel its physical conference this year, instead shifting to a Fully Virtual conference on 22-24 November 2021.
Abstract: English
Conference Language: Chinese
Conference Book: Download
the chair
It is with great enthusiasm that we announce the 2021 International Conference on Materials: Advanced and Emerging Materials (ICM-CN 2021). The conference will be held virtually from 22 to 24 November 2021.
This conference will provide leading scientists working in this field with a platform to share their latest research and engage in exciting discussions.
The main topics of the conference include but not limited:
- Electronic Materials;
- Biomaterials;
- Smart Materials;
- Energy Materials;
- Advanced Composites;
- Rare Earth Materials;
- Optics and Photonics;
- Advanced Nanomaterials and Nanotechnology;
- Structure Materials and Application;
- Porous Materials;
- Polymeric Materials;
- Quantum Materials.
All participants will be encouraged to submit an extended full manuscript to one dedicated Special Issue in Materials with a 500 CHF discount on the Article Processing Charge (APC). More information about Special Issue (Exclusive Papers Collection of 2021 International Conference on Materials: Advanced and Emerging Materials) can be found here.
We hope that you will join this Symposium to exchange ideas, communicate fruitful collaborations, and make this conference a success.
Kind regards,
Prof. Dr. Dongfeng Xue
The Chair of 2021 International Conference on Materials: Advanced and Emerging Materials
Meet the Event Chair
Important Dates
- Abstract submission deadlineNov 12, 2021
- Abstract acceptance notificationNov 15, 2021
- Full file submission deadlineNov 18, 2021
Meet Our Speakers
Prof. Dr. Sridhar Komarneni
Materials Research Institute and Department of Ecosystem Science and Management, The Pennsylvania State University, USA;
Prof. Dr. Jinzhong Zhang
Department of Chemistry and Biochemistry, University of California;
Prof. Dr. Nobuhito Imanaka
Department of Applied Chemistry, Faculty of Engineering, Osaka University, Japan;
Prof. Dr. Xueliang Sun
University of Western Ontario;
- 1. Electronic Material
- 2. Biomaterials and Smart Materials
- 3. Energy Materials
- 4. Functional Ceramics, Thin Films and Crystalline Materials
- 5. Rare Earth Materials and Optics and Photonics
Sponsors and Partners
Local organizer
Co-organizer
Cooperation
Host
Media partner
Sponsor
Ms. Angel Wang
Ms. Ariel Zhou
MDPI Branch Office, Beijing, China
E-Mail: materials-marketing@mdpi.com
Mr. Xiaoming Wang
Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS)
E-Mail: crystal-centre@siat.ac.cn
For information regarding submission inquiry and sponsoring opportunities, please feel free to contact us.
2021 MDPI Materials 国际材料会议：先进和新兴材料中文官网入口
Outstanding Oral Presentation Award
| Lei Liu | Tsinghua University | Shengping Hou | Kunming University of Science and Technology |
| Ning Yuan | Peking University | Ding Zhou |
|
| Lirong Liang | Macao University | Peng Qin | Technical Institute of Physics and Chemistry, CAS |
| Man Zhang | Sun Yat-Sen University | Huiwen Chen | Shenzhen Institute of Advanced Technology, CAS |
| Botao Gao | University of Science and Technology Beijing | Guoqiang Shi | Shenzhen Institute of Advanced Technology, CAS |
| Xuejiao Wang |
|
Feng Liu | Shenzhen Institute of Advanced Technology, CAS |
| Yongyong Cao | Jiaxing College | Shuping Liu | South University of Science and Technology of China |
Best Poster Award
| Michael R. Koblischka |
|
Peng Peng | Shenzhen University |
| Anjela Koblischka-Venev |
|
Xiangfei Sun | Shandong University |
| Iulia ANTOHE | University of Bucharest, Romania | Ke Li |
|
| Chandrakanth Reddy Chandraiahgari | Bruno Kessler Institute, Italy | Yijing Gao | Zhejiang Normal University |
| Gianina Popescu-Pelin | Romanian National Institute of Laser, Plasma and Radiation Physics | Yangqian Hou | Shanghai Institute of Applied Physics, CAS |
| Pedro P. Socoro-Perdomo | University of Las Palmas, Spain | Chun Cai | Shenzhen Institute of Advanced Technology,CAS |
| Huawei Qu | Shenzhen Institute of Advanced Technology,CAS |