.jpg)
The CIC 2027 is Now OPEN for Abstract Submission and Registration.
Instructions for authors are available online.
Submit your abstracts HERE.
For any inquiries, please contact us at cic2027@mdpi.com.
Dear Colleagues,
After the continued success of our previous virtual editions, we are delighted to announce the 5th Coatings and Interfaces Online Conference (CIC 2027). Over the years, CIC has become a leading global platform for scientists, engineers, and industry innovators to exchange cutting-edge research, explore emerging technologies, and foster meaningful collaborations in the rapidly advancing field of coatings and interfaces.
The influence of coatings and interface technologies continues to expand across scientific disciplines and industrial sectors. From next-generation manufacturing and sustainable energy solutions to cultural heritage preservation and biomedical innovation, this field plays a pivotal role in addressing both longstanding challenges and future societal needs.
CIC 2027 promises to deliver an even more inspiring and forward-looking program. Participants will gain insights into the latest breakthroughs, engage in interdisciplinary discussions, and explore innovative applications that are reshaping the landscape of materials science.
The conference will feature exciting sessions in the following thematic areas:
S1. Plasma and Laser Coatings, Surfaces, and Interfaces;
S2. Corrosion, Erosion and the Tribological/Smart/Diamond-Like Carbon Coatings;
S3. Coatings and Thin Film Deposition;
S4. Ceramic Coatings;
S5. Protective Coatings in Cultural Heritage, Conservation, and Preservation;
S6. The Biomedical Application of Coatings;
S7. Functional Polymer Coatings and Films.
As always, Coatings will welcome high-quality submissions to the Conference Special Issue, offering all participants a 20% APC discount.
We truly look forward to your participation in CIC 2027, where scientific excellence, innovation, and collaboration come together.
Download the conference flyer and share it with your colleagues!
On behalf of the Organizing Committee
The Conference Chair
Dr. Emerson Coy
Adam Mickiewicz University in Poznań, Poland
