- Electronics Journal Publication
Participants in this conference are cordially invited to contribute a full manuscript to the Special Issue, published in Electronics Journal (ISSN: 2079-9292, IF: 2.6, Indexed within Ei Compendex, SCIE (Web of Science), Scopus, CAPlus / SciFinder, Inspec, and other databases), with 20% discount on the article processing charge. All submitted papers will undergo MDPI’s standard peer-review procedure. The abstracts should be cited and noted on the first page of the paper. Please note if you have IOAP/association discounts, conference discounts will be combined with IOAP/association discounts. Conference discounts cannot be combined with reviewer vouchers.

- Engineering Proceedings Journal Publication
Participants are also welcome to submit a proceeding paper (4-8 pages) to the Engineering Proceedings journal (Indexed in Scopus, ISSN: 2673-4591) for free from 27 November 2024 to 15th January 2025.

The peer review process is handled by the proceedings editors.
Authors are asked to disclose that it is a proceeding paper of the ICSEE 2024 conference paper in their cover letter. Carefully read the rules outlined in the 'Instructions for Authors' on the journal’s website and ensure that your submission adheres to these guidelines.

You can submit the proceedings paper here after the conference.

Manuscripts for the proceedings issue must be formatted as follows:
- Title.
- Full author names.
- Affiliations (including full postal address) and authors' e-mail addresses.
- Abstract.
- Keywords.
- Introduction.
- Methods.
- Results and Discussion.
- Conclusions.
- Acknowledgements.
- References.