Introduction: Microfluidics refers to the science and technology of fluid flow at the microscale. Nowadays, microfluidic devices are ubiquitous, which makes it crucial to develop rapid and accessible microchip fabrication methods to realize all their potential applications. This work presents three alternative low-cost microfluidic device fabrication methods, accessible for fast prototyping in low-income or non-specialized laboratories.
Methods: Three alternative methods for microfluidic device fabrication that require low equipment investment and commercially available materials are compared: a) 3D precision cutting on adhesive sheets (simile crystal acetate, PVC film, packaging tapes, etc.) using computer numerical control (CNC) laser engraving (Neje® DK-8-KZ, 405nm wavelength, 1500 mW)); b) PDMS chip obtention from a master mold implemented on a chemically engraved copper-laminated board. The mold is obtained using chemical etching after transferring the channel design using laser prints and a heat source. Then, the soft lithography process is carried out on the mold with PDMS. The chip is sealed with a self-adhesive PCV film. c) 3D digital light processing (DLP) resin printing (Hellbot Apolo Pro printer). The chip is designed in a computer-aided design software environment (Fusion 360) where the printing parameters are configured. A ready-to-use chip is obtained.
Results and Discussion: The three proposed methods successfully achieved microfluidic device fabrication. The chips are capable of transporting fluids by capillarity and by external pumping. Each of these methodologies is low-cost and has advantages and disadvantages when compared to the others. The versatility and affordability of these protocols significantly expand the possibilities for research and experimentation in microfluidics, allowing a broader range of laboratories and professionals to contribute to the advancement of this discipline.
Conclusions: Low-cost microfluidic device fabrication can be achieved with the three affordable methodologies proposed and commercially available materials.