This study conducted an exploration of the influence exerted by polymer ANP at various concentrations on Cu electrodeposition onto brass surfaces. This endeavor sought to illuminate the effects of the ANP additive while meticulously scrutinizing the morphology of Cu electrodeposits. To achieve this, a multifaceted approach was adopted, integrating techniques such as scanning electron microscopy (SEM) coupled with energy-dispersive X-ray spectroscopy (EDS) and atomic force microscopy (AFM). Cyclic voltammetry served as a pivotal tool in unraveling the Cu electrodeposition mechanism, unraveling an irreversible system characterized by diffusion-controlled kinetics. The SEM/EDS and AFM analyses unveiled compelling insights, showcasing that the incorporation of ANP resulted in an enhancement in the quality of Cu electrodeposits. This enhancement was notably reflected in the improved roughness and crystallite size of the deposits. Moreover, electrochemical measurements were conducted to probe ANP's influence on the resistance of Cu electrodeposits within a 3.5 wt% NaCl medium. These measurements brought to light a significant increase in the polarization resistance of the Cu deposit in the presence of ANP. This elevation underscored the heightened corrosion resistance conferred by ANP, particularly in marine environments notorious for their corrosive nature. The incorporation of ANP into the electrodeposition process heralded noteworthy advancements in both the quality and resilience of Cu electrodeposits. The enhanced morphology and increased resistance to corrosion observed in the presence of ANP underscored its potential as a beneficial additive in the realm of materials science, particularly for applications demanding durability in challenging environments like marine settings.