Foreword: Proceedings of the 3rd International Electronic Conference on Sensors and Applications

¹ Politecnico di Milano, Dipartimento di Ingegneria Civile e Ambientale, Piazza L. da Vinci 32, 20133 Milano, Italy
² Mechanical and Aerospace Engineering & Chemical and Biomolecular Engineering, The Hong Kong University of Science and Technology Clear Water Bay Kowloon, Hong Kong, China
³ ISIS Sensorial Materials Scientific Centre, University of Bremen, 28359 Bremen, Germany
⁴ CEO and Co-Founder, Research to Market Solution s.r.l., Pavia, Italy
⁵ Politecnico di Torino, Department of Electronics and Telecommunications, corso Duca degli Abruzzi, 24, I-10129, Torino, Italy
⁶ Department of Mathematics and Computer Science, University of Bremen, 28359 Bremen, Germany

Published: 31 May 2017 by MDPI in 3rd International Electronic Conference on Sensors and Applications session Foreword

https://doi.org/10.3390/ecsa-3-03908

Abstract:

This issue of Proceedings gathers the papers presented at the 3rd International Electronic Conference on Sensors and Applications (ECSA-3), held online on 15-30 November 2016 through the sciforum.net platform developed by MDPI. The annual ECSA conference was initiated in 2014 on an online basis only, to allow the participation from all over the world with no concerns of travel and related expenditures. This type of conference looks particularly appropriate and useful because research concerned with sensors is rapidly growing, and a platform for rapid and direct exchanges about the latest research findings can provide a further burst in the development of novel ideas.

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