Please login first
Events About
Contact
My Submissions
The 3rd International Conference on AI Sensors and Transducers

The 3rd International Conference on AI Sensors and Transducers

The 3rd International Conference on AI Sensors and Transducers

Part of the International Conference on AI Sensors series
2–7 August 2026, Jeju, South Korea
Abstract Submission Deadline
31 March 2026
Abstract Acceptance Notification
30 April 2026

Early Bird Registration Deadline
16 May 2026
Covering Author Registration Deadline
23 May 2026
Registration Deadline
1 August 2026
Physical Sensors, Biosensors, Computer Vision, Sensors Applications, Sensing System, Chemical Sensors, Wearable Sensors, Artificial Intelligence
Calendar
Bookmark
Bookmark event Remove event from bookmarks
Add this event to bookmarks
Event Registration
Submit Abstract

Copy Link

Contact Us

Notification

Dear attendees,

Due to a change in the venue's availability, our conference will now be held from 2 to 7 August 2026 (instead of the originally planned 5 -10). We encourage you to update your calendars accordingly.

Share about the opportunities at AIS 2026
Please feel free to download and share our conference flyer with your students and colleagues:

Welcome from the Chairs

We are excited to announce that The 3rd International Conference on AI Sensors and Transducers will take place on 2–7 August 2026 in the beautiful city of Jeju, Korea. Building on the achievements of the 1st edition (Singapore, 2024) and the 2nd edition (Malaysia, 2025), this event will continue to set a high standard in the field. We are eager to once again bring together thought leaders and innovators from across the globe.

We are delighted to host you—the innovators, researchers, and experts who are shaping the future at the exciting intersection of sensors, sensing technology, transducers, and artificial intelligence. AIS 2026 is dedicated to exploring the very latest advancements in AI-enhanced sensing systems and transducers, a field evolving at a breathtaking pace.

We are confident this conference will be a stimulating, productive, and memorable experience for all. Let us embark together on this exciting journey of discovery and collaboration.

Welcome to the 3rd International Conference on AI Sensors and Transducers in Jeju, Korea!

Kind regards,
Prof. Inkyu Park, Korea Advanced Institute of Science and Technology
Prof. Zhou Li, Tsinghua University
Prof. Xinge Yu, City University of Hong Kong
Prof. Chengkuo Lee, National University of Singapore

Follow the conference organizer on Social Media

Event Chairs

Prof. Inkyu Park

Korea Advanced Institute of Science and Technology

Introduction
Bio
Professor Inkyu Park is a distinguished KAIST Chair Professor and Principal Investigator at the MINT Lab. With expertise in high-performance sensors and hybrid manufacturing technologies, he leads innovative research in bio/chemical sensors and nanomaterial-based devices. His work showcases a blend of excellence in academia and industry.

Prof. Zhou Li

Tsinghua University

Introduction
Bio
Prof. Zhou Li is a senior researcher and director at Tsinghua Changguang Hospital, School of Clinical Medicine, Tsinghua University, and School of Biomedical Engineering, Tsinghua University. His research focuses on bioelectronic devices, self-powered sensors, and biodegradable medical devices. Dr. Li has published over 300 papers and received numerous awards, including the National Natural Science Foundation Outstanding Young Scientist Fund, contributing significantly to biomedical engine.

Prof. Xinge Yu

City University of Hong Kong

Introduction
Bio
Xinge Yu is the Professor of Biomedical Engineering at City University of Hong Kong (CityUHK), Associate Director of Institute of Digital Medicine at CityUHK, Associate Director of Hong Kong Centre for Cerebro-cardiovascular Health Engineering, and Associate Director of the CAS-CityU Joint Lab on Robotics. Prof. Yu is the Member of the Hong Kong Young Academy of Sciences, recipient of RGC Research Fellow. He was selected as Innovators under 35 China (MIT Technology Review), NSFC Excellent Young Scientist Grant (Hong Kong & Macao), New Innovator of IEEE NanoMed, MINE Young Scientist Award, Gold Medal in the Inventions Geneva, CityU Outstanding Research Award, Stanford's top 2% most highly cited scientists etc. Xinge Yu’s research group is focusing on skin-integrated electronics and systems for VR and biomedical applications. Dr. Yu is the Associate Editor of Science Advances, Editroal Board for 10 journals. He has published 200 papers in Nature, Nature Materials, Nature Biomedical Engineering, Nature Machine Intelligence, Nature Communications, Science Advances etc., and 50 patents filed/granted.

Prof. Chengkuo Lee

National University of Singapore

Introduction
Bio
Prof. Lee is the GlobalFoundries Chair Professor in Engineering and director of the Center for Intelligent Sensors and MEMS at the National University of Singapore, Singapore. He is a Fellow of OPTICA. He co-founded Asia Pacific Microsystems, Inc. (APM) in 2001, where he was Vice President of R&D from 2001 to 2005. From 2006 to 2009, he was a Senior Member of the Technical Staff at the Institute of Microelectronics (IME), A-STAR, Singapore. His research interests include MEMS, NEMS, nanophotonics, Si Photonics, metamaterials, energy harvesting, wearable sensors, wearable electronics, flexible electronics, artificial intelligence of things (AIoT), Internet of Things (IoT), edge computing, in-sensor computing, electroceuticals, and biomedical applications. Prof. Lee has trained 40+ Ph.D. students who graduated from the ECE Dept., NUS. He has co-authored 550+ journal articles. He holds 10 US patents. His Google Scholar citation is more than 47000. Furthermore, he is Highly Cited Researcher Designations in 2023 and 2024 (Clarivate). According to the data from D-index (Discipline H-index) from Research.Com, he ranks 147 among all the electronics and electrical engineering scientists globally, based on the data April 2025. According to the data from Scopus till October 1, 2023, Elsevier has analyzed the academic performance of the top 100,000 scientists by c-score and the top 2% scientists in 174 sub-fields globally (a total of more than 200,000 scientists). In this report, Prof. Lee is ranked 13,936 globally in the total citations (excluding self-citations) among all the scientists, with an h-index of 62 (excluding self-citations). In the subfield of Nanoscience and Nanotechnology, he ranks 288 globally on the composite indicator score. On the other hand, his D-index (Discipline H-index) ranks 300 among all the electronics and electrical engineering scientists globally, based on the data till December 21, 2022.

Steering Committee

Prof. Sang-Woo Kim
Yonsei University
Prof. Xiaogang Liu
National University of Singapore
Prof. Po-Liang Liu
National Chung-Hsing University


Prof. Xinge Yu
City University of Hong Kong
Prof. Guangya Zhou
National University of Singapore
Prof. Toshihiro Itoh
The University of Tokyo


Prof. Chwee Teck Lim
National University of Singapore

Plenary Speakers


Prof. Wei Gao		 California Institute of Technology
Wei Gao is a Professor of Medical Engineering and Heritage Medical Research Institute Investigator at the California Institute of Technology. He earned his Ph.D. from the University of California, San Diego in 2014, followed by a postdoctoral fellowship at the University of California, Berkeley from 2014 to 2017. He is a recipient of NSF Career Award, ONR Young Investigator Award, IAMBE Early Career Award, Sloan Research Fellowship, Pittcon Achievement Award, IEEE EMBS Early Career Achievement Award, IEEE EMBS Technical Achievement Award, IEEE Sensor Council Technical Achievement Award, MIT Technology Review 35 Innovators Under 35, and Falling Walls Breakthrough of the Year in Engineering and Technology. He is a World Economic Forum Young Scientist, a Highly Cited Researcher (Web of Science). He is an elected Fellow for AIMBE and RSC. His research interests include wearable biosensors, digital medicine, bioelectronics, additive manufacturing, and micro/nanorobotics.

Prof. Mo Li		 University of Washington

Mo Li is a Professor of Electrical & Computer Engineering and Professor of Physics at the University of Washington (UW). Prior to joining UW in 2018, he was a faculty member in the Department of Electrical and Computer Engineering at the University of Minnesota since 2010. From 2007 to 2010, he was a postdoctoral associate in the Department of Electrical Engineering at Yale University. He received his Ph.D. degree in Applied Physics from Caltech in 2007 and a B.S. degree in Physics from the University of Science and Technology of China (USTC) in 2001. Dr. Li is the principal investigator of the Laboratory of Photonic Systems at UW. His main research interests include integrated photonics, optoelectronics, optomechanics, and quantum photonics. He is an elected fellow of Optica (former OSA).

Abridged Program

2 August 2026 (Sunday) Afternoon: Registration
3 August 2026 (Monday): Technical Program
4 August 2026 (Tuesday): Technical Program + Social activity
5 August 2026 (Wednesday): Technical Program + Poster session
6 August 2026 (Thursday): Technical Program/Social Activity
7 August 2026 (Friday): Academic Visit Program

Symposia (Continuously Updated)

Symposium name: AI-driven Biomedical Imaging and Diagnostics
Symposium chair:
Prof. Xiaogang Liu
National University of Singapore
Symposium name: Soft sensors and actuators for human machine interface
Symposium chair
Prof. Xinge Yu
City University of Hong Kong
Symposium name: AI-accelerated Design for Materials and Sensors
Symposium chair
Prof. Po-Liang Liu
National Chung-Hsing University
Symposium name: Sensing technology for natural environment and harsh environment
Symposium chair
Prof. Toshihiro Itoh
The University of Tokyo
Symposium name: Metasurface and Metaoptics
Symposium chairs
Prof. Jinghua Teng
A*STAR Research		 Prof. Junsuk Rho 
Pohang University of Science and Technology
Symposium name: AI sensors for smart healthcare applications
Symposium chair
Prof. Inkyu Park
Korea Advanced Institute of Science and Technology
Symposium name: Nanogenerator and Self-powered Sensors
Symposium chairs
Prof. Zhen Wen
Soohow University		 Prof. Ju-Hyuck Lee
Daegu Gyeongbuk Institute of Science & Technology		 Prof. Min-Hsin Yeh
Taiwan University of Science & Technology
Symposium name: AI-Driven Bio/Chemical Sensors
Symposium chair
Prof. Hong Zhou

Northwestern Polytechnical University
Symposium name: AI Enhanced Bioelectronics
Symposium chair
Prof. Zhou Li

Tsinghua University
Symposium name: Energy harvesting technology and intelligent sensing applications
Symposium chairs
Prof. Shengxi Zhou

Northwestern Polytechnical University

 Prof. Zhihui Lai

Shenzhen University

 Prof. Junlei Wang

Zhengzhou University

More details regarding the symposium, including chairs and invited speakers, are being updated continuously.

Instructions for Authors

To present your research at the event
  • Create an account on Sciforum if you do not have one, then click on Submit Abstract at the top of the Conference website to submit your abstract.
  • Indicate which thematic area is best suited for your research.
  • The structure abstract should include the introduction, methods, results, and conclusions sections of about 200–300 words in length.
  • The deadline to submit your abstract is 31 March 2026. You will be notified by 30 April 2026 regarding the acceptance.
  • Upon submission, you can select if you wish to be considered for oral presentation or poster presentation. Following assessment by the Chairs, you will be notified in a separate email whether your contribution has been accepted for oral or poster presentation.
  • Please note that to finalize the scientific program in due time, at least one registration by any of the authors, denoted as Covering Author, is required to cover the presentation and publication of any accepted abstract.
  • All abstracts accepted for presentation will be collected in a book of abstracts, which will be displayed on the website during the conference.
Oral Presentation and Slides Submission

The slot for the oral presentation is 15 mins (Presentation & Q&A). Authors are encouraged to prepare a presentation in PowerPoint or similar software. We will send you the link to upload your slides before the conference.

Poster information

Each presenter will be provided with a vertical poster board. The poster size is 90 cm x 140 cm. Please print your poster prior to the conference. A plan of the poster session will be circulated later on.

You can use our free template to create your poster. The poster template can be downloaded here.

Publication opportunities

  • Conference Full articles Publications in Organizer Journals
    Participants of the conference are cordially invited to submit full manuscripts to the following publication options:

    - Special Issue in Sensors (ISSN: 1424-8220, IF: 3.5) - 20% discount on the Article Processing Charge (APC).

    - Topics Collections in Participating Journals: Sensors (ISSN: 1424-8220, IF: 3.5), Micromachines (ISSN: 2072-666X, IF: 3.0), AI Sensors (ISSN: 3042-5999), Micro (ISSN: 2673-8023, IF: 1.9), Remote Sensing (ISSN: 2072-4292, IF: 4.1) - 20% discount on the Article Processing Charge (APC).

    Please note if you have IOAP/association discounts, conference discounts will be combined with IOAP/association discounts. Conference discounts cannot be combined with reviewer vouchers. No additional discounts are applicable beyond the above. All submitted papers will undergo MDPI’s standard peer-review procedure. The abstracts should be cited and noted on the first page of the paper.

  • Engineering Proceedings Journal Publication
    You are welcome to submit a proceeding paper (4-8 pages) to Engineering Proceedings Journal (Indexed in Scopus, ISSN: 2673-4591) after the conference. Publication of the proceedings will be free of charge.

    Authors are asked to disclose that it is a proceeding paper of the AIS2026 conference paper in their cover letter. Carefully read the rules outlined in the 'Instructions for Authors' on the journal’s website and ensure that your submission adheres to these guidelines.

    Proceedings paper submission period: 7 August–10 September 2026.

Registration


The registration fee includes attendance of all conference symposia, morning / afternoon coffee breaks and lunches, participation in the conference banquet, conference bag. Participation to the conference is considered final only once the registration fees have been paid.

Please note that, in order to finalize the scientific program in due time, at least one registration by anyone of the authors, denoted as Covering Author, is required to cover the presentation and publication of any accepted abstract. Covering Author registration deadline is 23 May 2026.

Please note that abstract submission and conference registration are two separate processes. During registration, please provide us with the same email address you used to submit your abstract(s). Otherwise, leave us a comment in the registration form, providing the email address used during the submission process. In addition, we prefer you to use your institutional email address for both processes.

If you are registering several people under the same registration order, please do not use the same email address for each person, but their individual institutional email addresses. Thank you for your understanding.

Contact ais2026@mdpi.com for all issues related to the registration.

Certificate of Attendance: Participants of the event will be able to download an electronic Certificate of Attendance by accessing their dashboards on Sciforum.net once the event is concluded. The certificates will be found under "My Certificates" category.

*Tax is included in the price.
Early Bird
Until 16 May 2026 		Regular
Until 1 August 2026 		Supported documents
Academic 600.00 EUR 700.00 EUR
Keynote/Invited speaker 550.00 EUR 650.00 EUR Please upload your invitation email.
Student 400.00 EUR 500.00 EUR Please upload a valid proof of your student identify, e.g. Certificate of Study, Student ID Card.
Non-academic 800.00 EUR 900.00 EUR
Free Registration Options
Supported documents
Sponsorship attendee Please upload your signed sponsorship form.

Active discounts

Group of 3: 5% discount

Note: Group size refers to the number of registered attendees in the same registration order.

Cancellation policy

Participation to the conference is considered final only once the registration fees have been paid. The number of participants is limited, once the number of paid registrations reaches the maximum number of participants, unpaid registrations will be cancelled.

Cancellation of paid registration is possible under the terms listed below:
≥ 1 month before the conference Full refund but 130 EUR are retained for administration
≥ 3 weeks before the conference Refund 50% of the applying fees
≥ 2 weeks before the conference Refund 25% of the applying fees
< 2 weeks before the conference No refund

Disclaimer
In the unlikely event that AIS 2026 Conference Secretariat shall deem it necessary to cancel the conference, all pre-paid registration fees will be reimbursed. AIS 2026 Conference Secretariat shall not be liable for reimbursing the cost of travel or accommodation arrangements made by individual delegates.

The statements, opinions, and data presented in this conference or on this website are solely those of the individual participant(s) and contributor(s) and not of MDPI. MDPI disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content.

Photographs and/or video will be taken during the conference
By taking part in this event, you grant the event organizers full rights to use the images resulting from the photography/video filming, and any reproductions or adaptations of the images for fundraising, publicity or other purposes to help achieve the conference’s aims. This might include (but is not limited to), the right to use them in their printed and online publicity, social media, press releases and funding applications.

Insurance
The organizers do not accept liability for personal accident, loss, or damage to private property incurred as a result of participation in AIS 2026. Delegates are advised to arrange appropriate insurance to cover travel, cancellation, or medical costs, and theft or damage of belongings.

Payment methods

Wire transfer, Credit card

Currencies accepted by this event

Swiss francs (CHF) ,  Euros (EUR) ,  US dollars (USD) ,  Pounds sterling (GBP) ,  Japanese yen (JPY) ,  Canadian dollars (CAD) and Singapore dollars (SGD)

Event Awards


We are excited to announce four prestigious awards in recognition and celebration of the outstanding contributions made by our participants during AIS 2026.

  1. Best Presentation Award
    • Eligibility: Open to all authors who have given an oral presentation.
    • Criteria: Based on the quality of content, delivery, engagement with the audience, and overall impact.
  2. Best Poster Award
    • Eligibility: Open to all researchers who have showcased their work through posters.
    • Criteria: Judged on scientific merit, creativity, and ability to attract attention and engage with viewers.
  3. Best Student Paper Award
    • Eligibility: Exclusively for students who have presented their work in an oral presentation format.
    • Criteria: Based on the quality of content, delivery, engagement with the audience, and overall impact.
  4. Best Scientist Award
    • Eligibility: Open to all invited speakers who have delivered their talks.
    • Criteria: Based on the quality of content, delivery, engagement with the audience, and overall impact.

The winners will be selected by a panel of judges consisting of esteemed expert in related field.

Announcement of Winners: The winners of these awards will be announced during the closing ceremony of the conference. We encourage all participants to attend.

Organizers

Supporting Organizations

National University of Singapore
The National University of Singapore aspires to be a vital community of academics, researchers, staff, students and alumni working together in a spirit of innovation and enterprise for a better world. Our singular focus on talent will be the cornerstone of a truly great university that is dedicated to quality education, influential research and visionary enterprise, in service of country and society.
Korean American Semiconductor Professional Alliance (KASPA)
The Korean American Semiconductor Professional Alliance (KASPA) is a U.S.-based 501(c)(3) nonprofit organization dedicated to empowering professionals, students, and businesses in the semiconductor industry. Founded in 2024, KASPA fosters workforce development, mentorship, and career growth while cultivating a dynamic and inclusive community.

KASPA promotes knowledge sharing by providing valuable resources, industry insights, and access to a robust network of like-minded professionals. Through initiatives such as scholarships, internships, educational workshops, and global partnerships, KASPA strengthens the talent pipeline, fosters collaboration, and supports innovation across the semiconductor ecosystem.

Learn more at www.koamspa.com
Smart Cities Council
The world's leading organization for Smart Cities, Smart Buildings, Strategies, Policy, Research and Technologies.

Learn more at https://www.smartcitiescouncil.com/
Australia Smart City Association
Together, we’re turning bold ideas into better places to live, work, and thrive.

Find out more: http://www.smartcity.org.au
Internet Of Things Hong Kong (IOTHK)
IOTHK is a technology , R&D non-profit organization, In addition to providing Smart City Platform (AIoT Smart City Cloud SaaS), IPX , BGP, Data Center services for its members, it also serves as a platform for various sectors to share information and explore opportunities related to Internet of Things (IoT), AI, and other technologies. It aims to act as a bridge between the East and West, helping to uncover and explore more business opportunities in mainland China and overseas markets.

Find out more: https://www.iothk.net
Taiwan Smart City Solutions Alliance (TSSA)
We are pleased to partner with the TSSA to promote greater innovation opportunities for smart technology applications around the world. With its Smart City Summit & Expo (SCSE) platform, the TSSA seeks to create strong global networks for groups and individuals who share the vision on driving the upgrades of IoT technologies and smart cities.

You can find out more about the TSSA and the SCSE here:
https://en.smartcity.org.tw/index.php/en-us/
The MicroLED Industry Association
The MicroLED Industry Association was established in 2022 to accelerate the adoption of microLED display technologies. The association brings together companies, researchers and organizations active in the MicroLED industry and provides the ideal forum for solving common technology issues, fostering cooperation and sharing relevant information, resources and tools. Members include leading industry companies (such as LG Electronics, Corning, Aledia, and ams Osram), supply chain companies (such as Plessey Semiconductors, Coherent, VueReal, and Polar Light), and researchers (such as CEA Leti, UCSB, and the Fraunhofer IZM).

Find out more here:
https://www.microledassociation.com/

The British Association of Remote Sensing Companies
BARSC is proud to be a supporting organisation for the 3rd International Conference on AI Sensors and Transducers Conference.

BARSC's mission is to increase the commercial use of earth imagery throughout the world and across every application by promoting out members’ capabilities and skills, whilst educating new and existing uses as to the benefits of this remarkable technology.

Find out more here:
https://www.barsc.org.uk/

Partnering Society

Robotic Society of Singapore (RSS)

The registration of RSS was approved by the Singapore government on 29 November, 2010 and was given the UEN number, which is T10SS0158F. RSS is a professional, and not-for-profit, organization in Singapore. RSS aims at nurturing friendship and promoting robotics among those corporations and individuals who believe that robots will be a big thing to come, to play, and to contribute to the mankind and the modern society. RSS is one of the founding members of Pacific-Asia Robotics Society Union (PARSU) (www.asian-robotics.org). RSS is also one of the founding members of World Robot Cooperation Organization (WRCO) with the headquarter located in Beijing, China.

Find out more at: www.rss.org.sg

Sponsors and Partners

The AIS 2026 committe is proud to present our media partners!

Media Partners

Sponsorship Opportunities

With a global audience of academic and industry participants, we will connect you to your target audience. Explore our sponsorship benefits and join us in shaping the future of sensors-related research and innovation at AIS 2026!

Download our sponsorship brochure here:


Secure your Competitive Advantage at AIS 2026
Gain Valuable Leads from over 500+ participants, including researchers from leading institutions and industry.

Benefits for ALL Sponsors, Regardless of Package:
-Display your logo, website link and organization's description on this webpage.
-Your logo will be displayed on our digital and physical book of abstracts.

Enjoy Direct Access and Networking with our VIPs and Industry Leaders:
- We are pleased to offer you exclusive opportunities to connect at our banquet and appreciation dinners.

Email us to find out more:
Feel free to contact our partnerships and sponsorships representative at ais2026@mdpi.com

[Exclusive!] Tiered Sponsorship Packages

Platinum
€5,000

Gold
€3,500

Silver
€2,000

Bronze
€800

Logo and Link on Conference Webpage

✓

✓

✓

✓

Logo and Link in the conference booklet (printed version) and in the book of abstracts (online version)

✓

✓

✓

✓

Mention in the Thank You email

✓

✓

✓

✓

Welcome post as a Conference sponsor on our Social Media Platforms

✓

✓

✓

✓

Exhibit Booth (1 Table)

✓

✓

✓

Included on physical MDPI promo posters and roll-up banners

✓

✓

✓

Complimentary Conference Registration

3

2

2

Logo shown during Banquet or Appreciation Dinner

✓

✓

Presentation of your company during the Banquet or Appreciation Dinner

✓

VIP seats in conference gala dinner (1 pax only)

✓

Visa Information

Visa-Free Entry to Jeju
Jeju Island offers visa-free entry to citizens of many countries. Please click here for a list of countries whose citizens do or do not require a visa to enter Jeju.

Note: Jeju’s visa-free access policy applies only to passengers taking direct flights to Jeju International Airport. (The visa-free policy is not applicable for passengers arriving at Jeju via Incheon International and/or Gimpo International Airports) For details, please check here.

Travelers from visa-exempt countries must obtain a K-ETA (Korea Electronic Travel Authorization) before departure. Please visit here to check your country and period of stay.

Countries Not Eligible for Visa-Free Entry
Citizens of some countries that need visas to enter Jeju island are not included. For the current and complete list of these countries, please visit the official link here.

For detailed information on how to apply for a visa, please refer to the official guideline.

Please note that you must apply for your own visa. MDPI is not responsible for any part of the visa application process for attendees. However, MDPI can provide a Visa Support Letter. To be eligible for such a document, the criteria below must be fulfilled.

Visa Support Letter
- Applicant must have paid for registration and submitted an abstract in order to receive a letter of support.
- Applicant must provide us with a scan of their valid, in-date passport that contains a photo of them.
- Applicant must provide us with a letter of support from their institution to confirm that it supports the delegate attending the meeting.
- This must be carried out in good time before the meeting; "last-minute" requests will not be processed.

Conference Secretariat

Dr. Alina-Andrada Igna
Ms. Alethea Liu
Mr. Benjamin Tay
Ms. Elara Liu

ais2026@mdpi.com

Top