In recent years, the transformation of micro-grid laboratories has accelerated toward more integrated, real-time, and data-driven environments. The evolution from early control-validation setups to advanced Power Hardware-in-the-Loop (PHIL), Co-Simulation, and Digital Twin (DT) frameworks has enabled a new generation of smart-grid experimentation emphasizing interoperability, scalability, and cyber-resilience. Modern testbeds now merge real-time simulators, HELICS/FMI-based middleware, and cloud-linked monitoring systems to create hybrid validation environments that reproduce complex grid interactions with high fidelity and automation. This convergence allows simultaneous testing of control, communication, and operational layers while bridging laboratory models with live field data. However, challenges remain in affordability, latency control, data standardization, and reproducibility, particularly for universities and utilities in resource-limited regions. This study presents a systematic review of micro-grid testbed developments between 2015 and 2025, classifying and comparing representative PHIL, Co-Simulation, and Digital Twin architectures. This study highlights open-architecture design approaches, interoperable standards, such as IEC 61850, IEEE 2030.5, and MQTT/REST, and cybersecurity-ready interfaces suitable for distributed validation. A five-step implementation roadmap is proposed to guide the development of low-cost, reproducible, and industry-aligned laboratories. The findings demonstrate that the convergence of real-time simulation, cross-domain synchronization, and Digital Twin intelligence represents a decisive step toward the next generation of sustainable, validated, and data-centric micro-grid testbeds.
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Evolution of Smart and Micro-Grid Laboratories toward Real-Time Co-Simulation and Digital Twin Testbeds
Published:
06 February 2026
by MDPI
in The 1st International Online Conference on Designs
session Smart Grids and AI-Enabled Energy Management Systems
Abstract:
Keywords: Smart Grid; PHIL; Co-Simulation; Digital Twin; IEC 61850; Interoperability