Experimental studies were conducted to determine if the stresses occurring during the manufacturing process of fibre metal laminates cause irreversible damage to electronic components. This is especially interesting for electronic systems to be embedded into such FML for later structural health monitoring purposes. Depending on the requirements of the used prepreg material, required temperatures and pressures for manufacturing can be quite high. First studies were conducted on electronic components separately, to validate their functionality after 3.5 hours at elevated temperatures and pressures, exceeding manufacturers specifications. The functionality tests were performed afterwards for every tested component. Further experiments will be conducted investigating the influence on a fully functional, programmed electronic system under the same conditions to investigate the influence on memory and soldering joints as well.