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The Eighteenth International Conference of Experimental Mechanics

1–5 Jul 2018, Brussels, Belgium
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Welcome from the Chairs

Clearly, the engineering community is moving towards a more global and digital world in which, thanks to the increased computational power, problems of high complexity can be analysed. Nevertheless, the relevance of experimental mechanics remains indisputable: with the increased interest in reliable design, durability analysis, life time prediction etc. experimental mechanics stays unquestionably of major importance. At the micron and submicron scale experimental mechanics provide the necessary techniques to study the influence of defects such as inclusions, cracks, voids and/or inherent manufacturing defects on the nucleation and growth of failure mechanisms. Recent advances in scanning probe microscopy techniques, transmission electron microscopy or diffraction techniques greatly increased the fundamental understanding of the material response and failure processes which occur under different complex loading conditions. Additionally, they proved to be useful for the development of the mathematical models that describe the material behavior. At the meso-level the current trend shows an increased use of full-field optical techniques for the monitoring of displacements and strains at the surface while embedded sensing systems like MEMS, optical fibers, Piezoelectric sensors/actuators etc. are extensively investigated for measurements inside the material. At the macro- or structural scale structural health monitoring techniques, including waves and vibrations seem to be beneficial for proactive maintenance planning and for prolonging the safe service life.

In general, experimental mechanics is indispensable also in the digital world of today, for instance for the verification and validation of the numerical tools which are used during design and analysis. Even more importantly, experimental methods provide the essential input data for these simulations. Undoubtedly, experimental mechanics always played a crucial role in all stages of a material’s or structure’s life cycle from research and design to production and use until liquidation and/or recycling and it always will.

ICEM18, the eighteenth International Conference of experimental Mechanics organized under the auspices of the European Society for Experimental Mechanics (EuraSEM) in July 1-5, 2018, in Brussels- Belgium, will bring a unique opportunity to get acquainted with the(se) latest exciting developments in the field of experimental mechanics. A unique opportunity to meet and interact with renowned international scientists and experts from academia and industry. It is the aim of the conference to provide a forum for discussion, exchange of new ideas, for the establishment of new friendships and collaborations and for the dissemination of recent acquired knowledge in an area of utmost scientific and technological importance.

Besides, the technical program, I hope you will also enjoy the city of Brussel, the capital of Belgium and of Europe. Brussels - a cosmopolitan city, easy to reach and famous for its Grand-Place, its Atomium, its Manneken-Pis, its beers, waffles and chocolates - is a beautiful city worth to explore and discover.

On behalf of the organizing committee and of the European society of Experimental Mechanics, I have the pleasure to invite to ICEM18 in Brussels. Thanks to your presence ICEM18 will be an unforgettable and rewarding gathering both from scientific, social and entertainment points of view.

We look forward to welcoming you to Brussels in July 2018.

For more details, please refer to: https://www.icem18.org/

Sessions

ICEM. ICEM 2018

Instructions for Authors

Open Access Conference Proceedings

On behalf of the ICEM18 Local Organizing Committee (LOC) I am extremely happy to communicate that the abstract review process is running at its full capacity and that the notification of abstract acceptance is ongoing.

Authors are now invited to submit a full length paper before May 1st, 2018. The ICEM18 conference proceedings will be published by the Multidisciplinary Digital Publishing Institute (MDPI) an academic open access publisher with headquarters in Basel, Switzerland.

Please note that the length of your manuscript is limited to 6 pages, including references and that your paper must be formatted according to the ICEM18 guidelines (see attachment).

After the peer-reviewing process the author is expected to submit her/his final manuscript before July 1, 2018.
The proceedings will be submitted for indexing by the Science Citation Index Expanded (SCIE) and Scopus indexing systems.

To submit a manuscript, please register on Sciforum.net with your email address first, if you do not have an account yet.

1) After logging in with their account, please click on "Submit Abstract" on the conference website to initiate the process.
2) Choose the appropriate conference session, symposium, workshop, etc.
3) Add the title, abstract and keywords, upload the PDF file of the full manuscript via “Abstract PDF” and word file via “Abstract original files” options (Please upload the full version here, not short abstract.)
4) Enter all authors, their e-mail addresses and affiliations, and click on "Save and send to editors" to finish the submission.

List of accepted submissions (176)

Id Title Authors
sciforum-019167 Proposal to standardize fatigue delamination growth tests using double cantilever beam specimens without fibre bridging



Submitted: 20 Apr 2018

Abstract: Show Abstract
Show Abstract
sciforum-019370 278 CHARACTERIZATION OF THE MODAL PARAMETERS OF COMPOSITE LAMINATES USING INNOVATIVE ULTRATHIN POLYMER WAVEGUIDE SENSOR FOILS , , Show Abstract
sciforum-019372 A robust test-based modal model identification method for challenging industrial cases , , , Show Abstract
sciforum-019413 539 Long-term in-situ study of stress corrosion cracking kinetics in a carbonate-rich solution



Submitted: 30 Apr 2018

Abstract: Show Abstract
Show Abstract
sciforum-019414 354 Experimental characterization of thermoplastics for use in heat exchangers , , , Show Abstract

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