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Keeping Cool Under Pressure: Dielectric Strength of Sheet Insulation in Boiling Liquid Nitrogen
Published: 01 June 2018 by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Applied Superconductivity
Institute of Electrical and Electronics Engineers (IEEE), Volume 28; 10.1109/tasc.2018.2813527
Keywords: stress, structure, liquid nitrogen, Pressure, Dielectric Strength, cooled, Nomex, Streß
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