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Kye-Sung Lee  - - - 
Top co-authors
Hwan Hur

10 shared publications

Division of Scientific Instrumentation, Korea Basic Science Institute, Daejeon 34133, South Korea

Ghiseok Kim

4 shared publications

Department of Biosystems and Biomaterials Science and Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Korea

Dong Uk Kim

1 shared publications

14
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8
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Publication Record
Distribution of Articles published per year 
(2014 - 2018)
Total number of journals
published in
 
10
 
Publications See all
Article 6 Reads 1 Citation High speed parallel spectral-domain OCT using spectrally encoded line-field illumination Kye-Sung Lee, Hwan Hur, Ji Yong Bae, I Jong Kim, Dong Uk Kim... Published: 22 January 2018
Applied Physics Letters, doi: 10.1063/1.5017078
DOI See at publisher website
PROCEEDINGS-ARTICLE 0 Reads 0 Citations 3D IC/Stacked Device Fault Isolation using Lock-in Infrared Microscopy Hwan Hur, Kye-Sung Lee Published: 01 January 2018
Imaging and Applied Optics 2018 (3D, AO, AIO, COSI, DH, IS, LACSEA, LS&C, MATH, pcAOP), doi: 10.1364/3d.2018.jtu4a.30
DOI See at publisher website
Article 0 Reads 0 Citations Laser Scanning Confocal Thermoreflectance Microscope for the Backside Thermal Imaging of Microelectronic Devices Dong Uk Kim, Chan Bae Jeong, Jung Dae Kim, Kye-Sung Lee, Hwa... Published: 30 November 2017
Sensors, doi: 10.3390/s17122774
DOI See at publisher website PubMed View at PubMed ABS Show/hide abstract
In this paper, we report on a confocal thermoreflectance imaging system that can examine the thermal characteristics of microelectronic devices by penetrating the backside of a device through the substrate. In this system, the local reflectivity variations due to heat generation in the device are measured point by point by a laser scanning confocal microscope capable of eliminating out-of-focus reflections and the thermoreflectance is extracted via Fourier-domain signal processing. In comparison to the conventional widefield thermoreflectance microscope, the proposed laser scanning confocal thermoreflectance microscope improves the thermoreflectance sensitivity by ~23 times and the spatial resolution by ~25% in backside thermoreflectance measurements.
PROCEEDINGS-ARTICLE 0 Reads 0 Citations Study on a magneto-rheological removal process of periodic turning marks Byeong-Joon Jeong, Sang-Won Hyun, Kye-Sung Lee, Jeong-Yeol H... Published: 16 October 2017
Optifab 2017, doi: 10.1117/12.2279870
DOI See at publisher website
Article 1 Read 0 Citations 3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental ... Ji Yong Bae, Kye-Sung Lee, Hwan Hur, Ki-Hwan Nam, Suk-Ju Hon... Published: 13 October 2017
Sensors, doi: 10.3390/s17102331
DOI See at publisher website PubMed View at PubMed ABS Show/hide abstract
Micro-electronic devices are increasingly incorporating miniature multi-layered integrated architectures. However, the localization of faults in three-dimensional structure remains challenging. This study involved the experimental and numerical estimation of the depth of a thermally active heating source buried in multi-layered silicon wafer architecture by using both phase information from an infrared microscopy and finite element simulation. Infrared images were acquired and real-time processed by a lock-in method. It is well known that the lock-in method can increasingly improve detection performance by enhancing the spatial and thermal resolution of measurements. Operational principle of the lock-in method is discussed, and it is represented that phase shift of the thermal emission from a silicon wafer stacked heat source chip (SSHSC) specimen can provide good metrics for the depth of the heat source buried in SSHSCs. Depth was also estimated by analyzing the transient thermal responses using the coupled electro-thermal simulations. Furthermore, the effects of the volumetric heat source configuration mimicking the 3D through silicon via integration package were investigated. Both the infrared microscopic imaging with the lock-in method and FE simulation were potentially useful for 3D isolation of exothermic faults and their depth estimation for multi-layered structures, especially in packaged semiconductors.
Article 8 Reads 0 Citations Spectrally encoded common-path fiber-optic-based parallel optical coherence tomography. Kye-Sung Lee, Hwan Hur, Ha-Young Sung, I Jong Kim, Geon-Hee ... Published: 15 September 2016
Optics Letters,
PubMed View at PubMed
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